OL-IP3338CX24: WLCSP


Overview

Wafer level chip-size package; 24 bumps
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
OL-IP3338CX24 WLCSP surface mount bottom UC 2.11 x 2.11 x 0.61 24 other
Manufacture Code Reference Codes Issue Date
WLCSP24 2011-07-06