OL-IP4309CX9

Wafer level chip-size package; 9 bumps; 1.16 x 1.16 x 0.66 mm


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Package VersionPackage NamePackage DescriptionReference CodesIssue Date
OL-IP4309CX9WLCSPWafer level chip-size package; 9 bumps; 1.16 x 1.16 x 0.66 mm2008-09-24

Products in this package

ESD, EMI and signal conditioning

Type numberDescriptionQuick access
IP4309CX9HDMI octal channel low capacitive high-performance ESD protection

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