OL-IP4338CX24

WLCSP24: wafer level chip-size package; 24 bumps


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Package versionPackage namePackage descriptionReference codesIssue date
OL-IP4338CX24WLCSPWLCSP24: wafer level chip-size package; 24 bumps2011-05-26

Products in this package

ESD, EMI and signal conditioning

Type numberDescriptionQuick access
IP4338CX2410-channel integrated filter network with ESD input protection to IEC 61000-4-2 level 4

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