OL-IP4342CX5

Wafer level chip-size package; 5 bumps; 0.76 x 1.06 x 0.66 mm


Package Selector

Outline drawing

Package VersionPackage NamePackage DescriptionReference CodesIssue Date
OL-IP4342CX5WLCSPWafer level chip-size package; 5 bumps; 0.76 x 1.06 x 0.66 mm2008-08-15

How to search?