OL-IP4350CX24

Wafer level chip-size package; 24 bumps; 2.11 x 1.95 x 0.70 mm


Package Selector

Outline drawing

Package VersionPackage NamePackage DescriptionReference CodesIssue Date
OL-IP4350CX24WLCSPWafer level chip-size package; 24 bumps; 2.11 x 1.95 x 0.70 mm2011-06-06

Products in this package

ESD, EMI and signal conditioning

Type numberDescriptionQuick access
IP4350CX249-channel SD memory card interface ESD protection filter to IEC 61000-4-2 level 4

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