OL-IP4352CX24

Wafer level chip size package; 24 bumps; 2.01 x 2.02 x 0.61 mm


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Outline drawing

Package versionPackage namePackage descriptionReference codesIssue date
OL-IP4352CX24WLCSPWafer level chip size package; 24 bumps; 2.01 x 2.02 x 0.61 mm 2009-07-06

Products in this package

ESD, EMI and signal conditioning

Type numberDescriptionQuick access
IP4352CX249-channel SD-memory card interface filter with ESD protection to IEC 61000-4-2 level 4

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