OL-IP4359CX4

Wafer level chip-size package; 4 bumps; 0.76 x 0.76 x 0.66 mm


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Package versionPackage namePackage descriptionReference codesIssue date
OL-IP4359CX4WLCSPWafer level chip-size package; 4 bumps; 0.76 x 0.76 x 0.66 mm2011-06-06

Products in this package

ESD, EMI and signal conditioning

Type numberDescriptionQuick access
IP4359CX4Dual channel low capacitance high performance ESD protection

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