OL-IP4365CX11

Wafer level chip-size package; 11 bumps


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Package versionPackage namePackage descriptionReference codesIssue date
OL-IP4365CX11WLCSPWafer level chip-size package; 11 bumps2011-07-06

Products in this package

ESD, EMI and signal conditioning

Type numberDescriptionQuick access
IP4365CX11Integrated (U)SIM card passive filter array and USB full speed ESD protection to IEC 61000-4-2 level 4

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