OL-IP4387CX4: WLCSP

Overview

Wafer level chip-size package; 4 bumps; 0.76 x 0.76 x 0.66 mm

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-IP4387CX4	WLCSP	surface mount	bottom	UC	0.76 x 0.76 x 0.66	4	other

Manufacture Code	Reference Codes	Issue Date
WLCSP4		2011-06-06