OL-IP4852CX25: WLCSP


Overview

Wafer level chip-size package; 25 bumps; 2.01 x 2.01 x 0.66 mm
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
OL-IP4852CX25 WLCSP surface mount bottom UC 2.01 x 2.01 x 0.66 25 other
Manufacture Code Reference Codes Issue Date
WLCSP25 2006-09-23