OL-IP4853CX24

Wafer level chip-size package; 24 bumps; 2.01 x 2.01 x 0.66 mm


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Package versionPackage namePackage descriptionReference codesIssue date
OL-IP4853CX24WLCSPWafer level chip-size package; 24 bumps; 2.01 x 2.01 x 0.66 mm2008-04-14

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