OL-LPC1102UK

Wafer level chip-size package; 16 bumps; 2.17 x 2.32 x 0.6 mm


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Package VersionPackage NamePackage DescriptionReference CodesIssue Date
OL-LPC1102UKWLCSPWafer level chip-size package; 16 bumps; 2.17 x 2.32 x 0.6 mm- - - (EIAJ); - - - (JEDEC); - - - (IEC); 2010-10-18

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Application note

Products in this package

Microcontrollers

Type numberDescriptionQuick access
LPC1102UK32-bit ARM Cortex-M0 microcontroller; 32 kB flash and 8 kB SRAM
LPC1104UK32-bit ARM Cortex-M0 microcontroller; 32 kB flash and 8 kB SRAM

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