OL-NCX8200UK: WLCSP


Overview

wafer chip-scale package; 9 bumps; 1.22 x 1.22 x 0.5 mm
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP surface mount bottom UC 1.22 x 1.22 x 0.5 9 plastic
Manufacture Code Reference Codes Issue Date
OL-NCX8200UK 2014-12-16