OL-NX3P191

Wafer level chip-size package.4 bumps; body 0.76 x 0.76 x 0.51 mm. (Backside Coating included)


Package Selector

Outline drawing

Package versionPackage namePackage descriptionReference codesIssue date
OL-NX3P191WLCSPWafer level chip-size package.4 bumps; body 0.76 x 0.76 x 0.51 mm. (Backside Coating included) 2011-06-10

How to search?