OL-NX3P191

Wafer level chip-size package.4 bumps; body 0.76 x 0.76 x 0.51 mm. (Backside Coating included)


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Package VersionPackage NamePackage DescriptionReference CodesIssue Date
OL-NX3P191WLCSPWafer level chip-size package.4 bumps; body 0.76 x 0.76 x 0.51 mm. (Backside Coating included)2011-06-10

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