OL-PCF2003DUS: WLCSP


Overview

wafer level chip-scale package; 8 bumps; 1.16 x 0.86 x 0.48 mm
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP surface mount bottom UC 1.16 x 0.86 x 0.48 8 plastic
Manufacture Code Reference Codes Issue Date
OL-PCF2003DUS 2015-08-17