OL-TDA1308AUK

Wafer level chip-size package; 8 bumps; 0.61 x 0.84 x 0.38 mm


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Package versionPackage namePackage descriptionReference codesIssue date
OL-TDA1308AUKWLCSPWafer level chip-size package; 8 bumps; 0.61 x 0.84 x 0.38 mm2006-12-15

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