OL-TFA9897: WLCSP


Overview

wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.50 mm
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP surface mount bottom UC 2.06 x 2.72 x 0.50 mm 30 other
Manufacture Code Reference Codes Issue Date
WLCSP30 2014-10-09