SOT1119-1: HBGA432

Overview

plastic thermal enhanced ball grid array package; 432 balls; heatsink

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1119-1	HBGA432	surface mount	bottom	HBGA	35 x 35 x 1.75	432	plastic

Manufacture Code	Reference Codes	Issue Date
SOT1119	MS-034(JEDEC);144E(IEC	2009-08-14

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