SOT1119-1

plastic thermal enhanced ball grid array package; 432 balls; heatsink


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Outline drawing

Package VersionPackage NamePackage DescriptionReference CodesIssue Date
SOT1119-1HBGA432plastic thermal enhanced ball grid array package; 432 balls; heatsinkMS-034 (JEDEC); 144E (IEC); 2009-08-14

Products in this package

Media processors

Type numberDescriptionQuick access
PNX5130EHVideo Post Processor

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