SOT1123-1

plastic thermal enhanced ball grid array package; 324 balls; heatsink


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Package VersionPackage NamePackage DescriptionReference CodesIssue Date
SOT1123-1HBGA324plastic thermal enhanced ball grid array package; 324 balls; heatsink- - - (EIAJ); MS-034 (JEDEC); 144E (IEC); 2009-06-09

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