SOT1172-1

plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad


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Package VersionPackage NamePackage DescriptionReference CodesIssue Date
SOT1172-1HTSSOP28plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad- - - (EIAJ); MO-153 (JEDEC); - - - (IEC); 2010-03-31

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