SOT1172-2

plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad


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Outline drawing

Package VersionPackage NamePackage DescriptionReference CodesIssue Date
SOT1172-2HTSSOP28plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die padMO-153 (JEDEC); - - - (IEC); - - - (EIAJ); 2010-07-13

Related documents

Reflow soldering

Products in this package

Interface and connectivity

Type numberDescriptionQuick access
PCA9952TW16-channel Fm+ I²C-bus 57 mA constant current LED driver
PCA9955TW16-channel Fm+ I²C-bus 57 mA constant current LED driver
PCU9955TW16-channel UFm I²C-bus 57 mA constant current LED driver

Lighting driver and controller ICs

Type numberDescriptionQuick access
PCA9952TW16-channel Fm+ I²C-bus 57 mA constant current LED driver
PCA9955TW16-channel Fm+ I²C-bus 57 mA constant current LED driver
PCU9955TW16-channel UFm I²C-bus 57 mA constant current LED driver

Power management

Type numberDescriptionQuick access
PCA9952TW16-channel Fm+ I²C-bus 57 mA constant current LED driver
PCA9955TW16-channel Fm+ I²C-bus 57 mA constant current LED driver
PCU9955TW16-channel UFm I²C-bus 57 mA constant current LED driver

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