SOT1445-2: WLCSP

Overview

wafer level chip-scale package; 6 bumps; 0.69 mm x 0.44 mm x 0.29 mm

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1445-2	WLCSP	surface mount	bottom	WLCSP	0.69 x 0.44 x 0.29	6

Manufacture Code	Reference Codes	Issue Date
SOT1445		2016-12-06