SOT1461-1: WLCSP


Overview

WLCSP13, wafer level chip-size package; 13 bumps, 0.4 mm pitch, 2.74 mm x 2.80 mm x 0.38 mm body
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP surface mount bottom WLCSP 2.74 x 2.80 x 0.38 13 other
Manufacture Code Reference Codes Issue Date
SOT1461 2016-08-08
Part Description Quick access
4 Mbit Serial EEPROM