SOT1780-4: WLCSP36


Overview

WLCSP36, wafer level chip-scale package; 36 bumps; 0.4 mm pitch, 2.62 mm x 2.51 mm x 0.525 mm body (backside coating included)
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP36 surface mount bottom WLCSP 2.62 x 2.51 x 0.525 36
Manufacture Code Reference Codes Issue Date
98ASA01158D 2017-12-20