SOT1783-1: WLCSP80


Overview

WLCSP80, wafer level chip-size package; 80 terminals; 0.4 mm pitch; 3.56 mm x 4.13 mm x 0.6 mm body
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP80 surface mount bottom WLCSP 3.56 x 4.13 x 0.6 80
Manufacture Code Reference Codes Issue Date
98ASA00710D 2017-06-11