SOT519-1

plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm


Outline drawing

Package versionPackage namePackage descriptionReference codesIssue date
SOT519-1SSOP16plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm2003-02-18

Related documents

Application note

Reflow soldering

Wave soldering

Products in this package

ESD, EMI and signal conditioning

Type numberDescriptionQuick access
IP4772CZ16VGA/video interface with integrated buffers, ESD protection and integrated termination resistors

Interface and connectivity

Type numberDescriptionQuick access
NE1617ADSTemperature monitor for microprocessor systems
NE1619DSHECETA4 Temperature and voltage monitor

Logic

Type numberDescriptionQuick access
74CBTLV3125DS4-bit bus switch
74CBTLV3126DS4-bit bus switch
74CBTLV3253DSDual 1-of-4 multiplexer/demultiplexer
74CBTLV3257DSQuad 1-of-2 multiplexer/demultiplexer
CBT3125DSQuadruple FET bus switch
CBT3126DSQuad FET bus switch
CBT3251DS1-of-8 FET multiplexer/demultiplexer
CBT3253ADSDual 1-of-4 FET multiplexer/demultiplexer
CBT3257ADSQuad 1-of-2 multiplexer/demultiplexer
NX5DV330DSQuad 1-of-2 video multiplexer/demultiplexer

Sensors

Type numberDescriptionQuick access
NE1617ADSTemperature monitor for microprocessor systems
NE1619DSHECETA4 Temperature and voltage monitor

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