SOT549-1

plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad


Outline drawing

Package versionPackage namePackage descriptionReference codesIssue date
SOT549-1HTSSOP32plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die padMO-153 (JEDEC); 2005-11-02

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Application note

Reflow soldering

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Audio / video

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TDA8932BTWClass-D audio amplifier
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Automotive

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Interface and connectivity

Type numberDescriptionQuick access
UJA1061TWFault-tolerant CAN/LIN fail-safe system basis chip
UJA1065TWHigh-speed CAN/LIN fail-safe system basis chip
UJA1066TWHigh-speed CAN fail-safe system basis chip
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UJA1075ATWHigh-speed CAN/ LIN core system basis chip
UJA1076ATWHigh-speed CAN core system basis chip
UJA1078ATWHigh-speed CAN/dual LIN core system basis chip
UJA1079ATWLIN core system basis chip

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