SOT549-3

plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad


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Package versionPackage namePackage descriptionReference codesIssue date
SOT549-3HTSSOP32plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die padMO-153 (JEDEC); 2005-11-02

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