SOT553-1

plastic thermal enhanced ball grid array package; 292 balls; body 27 x 27 x 1.75 mm; heatsink


Outline drawing

Package versionPackage namePackage descriptionReference codesIssue date
SOT553-1HBGA292plastic thermal enhanced ball grid array package; 292 balls; body 27 x 27 x 1.75 mm; heatsinkMS-034 (JEDEC); 144E (IEC); 2002-02-27

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