SOT602-1

plastic thermal enhanced ball grid array package; 256 balls; body 27 x 27 x 0.9 mm; heatsink


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Package VersionPackage NamePackage DescriptionReference CodesIssue Date
SOT602-1HBGA256plastic thermal enhanced ball grid array package; 256 balls; body 27 x 27 x 0.9 mm; heatsinkMS-034 (JEDEC); 144E (IEC); 2003-03-17

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