SOT604-1: HBGA504

Overview

plastic, thermal enhanced ball grid array package; 504 balls; 1.27 mm pitch; 35 mm x 35 mm x 0.9 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT604-1	HBGA504	surface mount	bottom	HBGA	35 x 35 x 1.65	504	plastic

Manufacture Code	Reference Codes	Issue Date
SOT604	MS-034(JEDEC);144E(IEC	2003-03-17