SOT636-1: HBGA388


Overview

plastic, heatsink ball grid array package; 388 balls; 1.27 mm pitch; 35 mm x 35 mm x 1.75 mm body
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
HBGA388 surface mount bottom HBGA 35 x 35 x 2.55 388 plastic
Manufacture Code Reference Codes Issue Date
SOT636 MS-034(JEDEC);144E(IEC 2001-12-11