SOT636-1

plastic heatsink ball grid array package; 388 balls; body 35 x 35 x 1.75 mm; heatsink


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Package versionPackage namePackage descriptionReference codesIssue date
SOT636-1HBGA388plastic heatsink ball grid array package; 388 balls; body 35 x 35 x 1.75 mm; heatsinkMS-034 (JEDEC); 144E (IEC); 2001-12-11

Related documents

Application note

Reflow soldering

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