SOT683-1: HBGA960


Overview

plastic thermal enhanced ball grid array package; 960 balls; body 33 x 33 x 2.4 mm; heatsink
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
HBGA960 surface mount bottom HBGA 960 plastic
Manufacture Code Reference Codes Issue Date
SOT683 MS-034(JEDEC 2002-05-01