SOT707-1: HBGA584


Overview

plastic thermal enhanced ball grid array package; 584 balls; body 37.5 x 37.5 x 1.42 mm; heatsink
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
HBGA584 surface mount bottom HBGA 584 plastic
Manufacture Code Reference Codes Issue Date
SOT707 2002-11-22