SOT727-1

plastic thermal enhanced low profile ball grid array package; 475 balls; body 35 x 35 x 0.9 mm; heatsink


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Package VersionPackage NamePackage DescriptionReference CodesIssue Date
SOT727-1HLBGA475plastic thermal enhanced low profile ball grid array package; 475 balls; body 35 x 35 x 0.9 mm; heatsinkMO-192 (JEDEC); 2002-02-07

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