SOT741-1

plastic ball grid array package; 376 balls; body 23 x 23 x 1.75 mm


Package Selector

Outline drawing

Package VersionPackage NamePackage DescriptionReference CodesIssue Date
SOT741-1BGA376plastic ball grid array package; 376 balls; body 23 x 23 x 1.75 mmMS-034 (JEDEC); 144E (IEC); 2002-01-14

Related documents

Reflow soldering

How to search?

Already registered to MyNXP? or Register

Feedback