SOT807-1: HBGA156


Overview

plastic thermal enhanced ball grid array package; 156 balls; body 15 x 15 x 1.15 mm; heatsink
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
HBGA156 surface mount bottom HBGA 156 plastic
Manufacture Code Reference Codes Issue Date
SOT807 MS-034(JEDEC 2003-03-06