SOT850-1

plastic thermal enhanced ball grid array package; 256 balls; body 17 x 17 x 1.4 mm; heatsink


Package Selector

Outline drawing

Package VersionPackage NamePackage DescriptionReference CodesIssue Date
SOT850-1HBGA256plastic thermal enhanced ball grid array package; 256 balls; body 17 x 17 x 1.4 mm; heatsinkMS-034 (JEDEC); 2004-03-19

How to search?