SOT865-3

plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm


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Package VersionPackage NamePackage DescriptionReference CodesIssue Date
SOT865-3HVQFN32plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mmMO-220 (JEDEC); 2009-02-05

Related documents

Reflow soldering

Products in this package

Microcontrollers

Type numberDescriptionQuick access
EM773FHN33Energy metering IC; up to 32 kB flash and 8 kB SRAM
LPC1111FHN338kB flash, 4kB SRAM, HVQFN32 package
LPC1112FHN3316kB flash, 4kB SRAM, HVQFN32 package
LPC1113FHN3324kB flash, 8kB SRAM, HVQFN32 package
LPC1114FHN3332kB flash, 8kB SRAM, HVQFN32 package
LPC11A11FHN338kB flash, 2kB SRAM, HVQFN32 package
LPC11A12FHN3316kB flash, 4kB SRAM, HVQFN32 package
LPC11A14FHN3332kB flash, 8kB SRAM, HVQFN32 package
LPC11C12FHN33
LPC11E11FHN338kB flash, 4kB SRAM, HVQFN32 package
LPC11E14FHN3332kB flash, 10kB SRAM, HVQFN32 package
LPC11E36FHN3332-bit ARM Cortex-M0 microcontroller; up to 128 kB flash; up to 12 kB SRAM and 4 kB EEPROM; USART
LPC11U12FHN3316kB flash, 6kB SRAM, HVQFN32 package
LPC11U14FHN3332kB flash, 6kB SRAM, HVQFN32 package
LPC11U24FHN3332kB flash, 8kB SRAM, HVQFN32 package
LPC11U34FHN3340kB flash, 8kB SRAM, HVQFN32 package
LPC11U35FHN3364kB flash, 10kB SRAM, HVQFN32 package
LPC1311FHN338kB Flash, 4kB SRAM
LPC1313FHN3332kB Flash, 8kB SRAM
LPC1315FHN3332kB Flash, 8kB SRAM
LPC1316FHN3348kB Flash, 8kB SRAM
LPC1317FHN3364kB Flash, 10kB SRAM
LPC1342FHN3316kB Flash, 4kB SRAM, USB Device
LPC1343FHN3332kB Flash, 8kB SRAM, USB Device
LPC1345FHN3332kB Flash, 10kB SRAM, USB Device
LPC1346FHN3348kB Flash, 10kB SRAM, USB Device
LPC1347FHN3364kB Flash, 12kB SRAM, USB Device

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