SOT900-1: HBGA456


Overview

plastic thermal enhanced ball grid array package; 456 balls; body 27 x 27 x 1.75 mm; heatsink
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
HBGA456 surface mount bottom HBGA 456 plastic
Manufacture Code Reference Codes Issue Date
SOT900 MS-034(JEDEC);144E(IEC 2005-09-02
Part Description Quick access
Connected media processor
Connected media processor
Connected media processor