WLCSP

Wafer level chip-size package; 8 bumps; 1.16 x 1.16 x 0.66 mm


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Package versionPackage namePackage descriptionReference codesIssue date
WLCSPWLCSPWafer level chip-size package; 8 bumps; 1.16 x 1.16 x 0.66 mm2007-05-25

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