sot855-4

plastic thermal enhanced thin quad flat package; 64 leads; exposed die pad


Package Selector

Outline drawing

Package versionPackage namePackage descriptionReference codesIssue date
sot855-4HTQFP64plastic thermal enhanced thin quad flat package; 64 leads; exposed die padMS-026 (JEDEC); 2011-04-12

Related documents

Application note

How to search?