
sot855-4
plastic thermal enhanced thin quad flat package; 64 leads; exposed die pad
| Package version | Package name | Package description | Reference codes | Issue date |
|---|---|---|---|---|
| sot855-4 | HTQFP64 | plastic thermal enhanced thin quad flat package; 64 leads; exposed die pad | MS-026 (JEDEC); | 2011-04-12 |
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