201801009F01 : LPC18xx LPC43xx BGA Package Cu Wire Qualification for NXP-ATKH

Copper wire has been qualified and will be added as a wirebond material. To support a robust wirebond process the mold compound has also changed. Upon effective date NXP will begin shipping product with copper wire.See attached Self Qualification Reports (SQR) for details of the affected part numbers material changes and qualification test results.Samples of the following superset part numbers will be available. LPC1830FET100 LPC1850FET180 LPC1850FET256LPC4350FET180 LPC4350FET256 LPC4370FET100 LPC1857FET256 LPC1857JBD208 LPC1857JET256LPC4367JBD208 LPC4367JET100 LPC4367JET256

Reason of Change

Adding Copper wire is required to mitigate against raw material cost increases and for supply assurance.The die attach material and mold compound change enable a robust Cu wirebond process.

Identification of Affected Products

Top side marking Product version is incremented. See marking details in attached Self Qualification Report (SQR) document.

Anticipated Impact

Data sheet revision: No impact to existing datasheet

Wire composition and mold compound are the only changes. No Impact to form fit or function. Reliability is equivalent or improved.

Affected Parts