NXP Semiconductors


Select site:

English

Datasheet

PESD1FLEX
(Product Specification)
15-Feb-08, 12 pages, 91 kB

Download all documentation

General description

PESD1FLEX in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package designed to protect two automotive FlexRay bus lines from the damage caused by ElectroStatic Discharge (ESD) and other transients.

Features

  • Due to the integrated diode structure only one small SOT23 package is needed to protect two FlexRay bus lines
  • Max. peak pulse power: PPP = 200 W at tp = 8/20 us
  • Low clamping voltage: VCL = 40 V at IPP = 1 A
  • Ultra low leakage current: IRM < 1 nA
  • Typ. diode capacitance matching: ΔCd/Cd = 0.1 pct
  • ESD protection up to 23 kV
  • IEC 61000-4-2, level 4 (ESD)
  • IEC 61000-4-5 (surge); IPP = 3 A at tp = 8/20 us
  • Small SMD plastic package

Products/packages

Type numberNorth American Type numberOrdering code (12NC)Product statusPackagePackingMarkingChemical contentLeadfree conversion date
PESD1FLEXPESD1FLEX T/R9340 612 59215Volume productionSOT23
(SST3)
Tape reel smdStandard MarkingPESD1FLEX

Pricing/ordering/availability

Type numberOrdering code(12NC)Indicative price/unit($)RegionDistributorIn stockInventory dateBuy onlineSamples
PESD1FLEX9340 612  59215  NAFUTURE ELECTRONICS5,4009/4/2008 Buy online Order samples

Applications

  • FlexRay bus protection
  • Automotive applications

Block diagrams/pinning

Technical documents

Support Documents

Support Models

Disclaimer

The information published on product information pages of the www.nxp.com or www.semiconductors.com websites is an extract from product data sheets and is for information purposes only. For detailed information please check the most recent version of the relevant product data sheet as published on these websites. In the event of any conflict between product information pages and data sheets or deviations from information provided in the product data sheets on these product information pages, the information provided in the product data sheets shall prevail.


The product status of the product(s) described in the product data sheet may have changed since publication of the data sheet and therefore information in datasheets on product status may be outdated. The latest information on product status is published on the product information pages of the above-mentioned websites.


As from October 1st, 2006 Philips Semiconductors has a new trade name - NXP Semiconductors, which will be used in future data sheets together with new contact details. In data sheets where the previous Philips references remain, please use the new links as shown below.


http://www.philips.semiconductors.com use http://www.nxp.com
http://www.semiconductors.philips.com use http://www.nxp.com (Internet)
sales.addresses@www.semiconductors.philips.com use salesaddresses@nxp.com (e-mail)

The copyright notice at the bottom of each page (or elsewhere in the document, depending on the version)
- © Koninklijke Philips Electronics N.V. (year). All rights reserved -
is replaced with:
- © NXP B.V. (year). All rights reserved.-


If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or phone (details via salesaddresses@nxp.com). Thank you for your cooperation and understanding.