SE97

General description

The NXP Semiconductors SE97 measures temperature from -40 Cel and +125 Cel and also provides 256 bytes of EEPROM memory communicating via the I²C-bus/SMBus. It is typically mounted on a Dual In-Line Memory Module (DIMM) measuring the DRAM temperature in accordance with the new JEDEC (JC-42.4) Mobile Platform Memory Module Temperature Sensor Component specification and also replacing the Serial Presence Detect (SPD) which is used to store memory module and vendor information.

Placing the Temp Sensor (TS) on a DIMM allows accurate monitoring of the DIMM module temperature to better estimate the DRAM case temperature (T_case) to prevent it from exceeding the maximum operating temperature of 85 Cel. The chip set throttles the memory traffic based on the actual temperatures instead of the calculated worst-case temperature or the ambient temperature using a temp sensor mounted on the motherboard. There is up to 30 pct improvement in thin and light notebooks that are using one or two 1 GB SO-DIMM modules, although other memory modules such as in server applications will also see an increase in system performance. Future uses of the TS will include more dynamic control over thermal throttling, the ability to use the Alarm Window to create multiple temperature zones for dynamic throttling and to save processor time by scaling the memory refresh rate.

The TS consists of a ΔΣAnalog to Digital Converter (ADC) that monitors and updates its own temperature readings 10 times per second, converts the reading to a digital data, and latches them into the data temperature register. User-programmable registers, the specification of upper/lower alarm and critical temperature trip points, EVENT output control, and temperature shutdown, provide flexibility for DIMM temperature-sensing applications.

When the temperature changes beyond the specified boundary limits, the SE97 outputs an EVENT signal using an open-drain output that can be pulled up between 0.9 V and 3.6 V. The user has the option of setting the EVENT output signal polarity as either an active LOW or active HIGH comparator output for thermostat operation, or as a temperature event interrupt output for microprocessor-based systems. The EVENT output can even be configured as a critical temperature output.

The EEPROM is designed specifically for DRAM DIMMs SPD. The lower 128 bytes (address 00h to 7Fh) can be Permanent Write Protected (PWP) or Reversible Write Protected (RWP) by software. This allows DRAM vendor and product information to be stored and write protected. The upper 128 bytes (address 80h to FFh) are not write protected and can be used for general purpose data storage.

The SE97 has a single die for both the temp sensor and EEPROM for higher reliability and supports the industry-standard 2-wire I²C-bus/SMBus serial interface. The SMBus TIMEOUT function is supported to prevent system lock-ups. Manufacturer and Device ID registers provide the ability to confirm the identity of the device. Three address pins allow up to eight devices to be controlled on a single bus. To maintain interchangeability with the I²C-bus/SMBus interface, the electrical specifications are specified with the operating voltage of 3.0 V to 3.6 V.

DIMM applications normally use the C-grade accuracy SE97PW or SE97TK temp sensor. For applications requiring the higher B-grade accuracy, the SE97PW/1 or SE97TK/1 is available.

Features

General features

• JEDEC (JC-42.4) SO-DIMM temperature sensor plus 256-byte serial EEPROM for Serial Presence Detect (SPD)
• Optimized for voltage range: 3.0 V to 3.6 V, but SPD can be read down to 1.7 V
• Shutdown current: 0.1 uA (typ.) and 3.0 uA (max.)
• 2-wire interface: I²C-bus/SMBus compatible, 0 Hz to 400 kHz
• SMBus Alert Response Address and TIMEOUT (programmable)
• ESD protection exceeds 2500 V HBM per JESD22-A114, 250 V MM per JESD22-A115, and 1000 V CDM per JESD22-C101
• Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
• Available packages: TSSOP8 and HVSON8

Temperature sensor features

• 11-bit ADC Temperature-to-Digital converter with 0.125 Cel resolution
• Operating current: 250 uA (typ.) and 400 uA (max.)
• Programmable hysteresis threshold: off, 0 Cel, 1.5 Cel, 3 Cel, 6 Cel
• Over/under/critical temperature EVENT output
• SE97PW/1, SE97TK/1 B-grade accuracy: +-0.5 Cel/+-1 Cel (typ./max.) → -20 Cel to +125 Cel
• SE97PW, SE97TK C-grade accuracy: +-0.5 Cel/+-2 Cel (typ./max.) → -20 Cel to +125 Cel

Serial EEPROM features

• Operating current:
  • Write → 0.6 mA (typ.) for 3.5 ms (typ.)
  • Read → 100 uA (typ.)
• Organized as 1 block of 256 bytes [(256 x 8) bits]
• 100,000 write/erase cycles and 10 years of data retention
• Permanent and Reversible Software Write Protect
• Software Write Protection for the lower 128 bytes

Products/packages

Pricing/ordering/availability

Applications

• DDR2 and DDR3 memory modules
• Laptops, personal computers and servers
• Enterprise networking
• Hard disk drives and other PC peripherals

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Technical documents

Application Notes

AN10216_1; I2C manual (27-Mar-03)

AN10441_1; Level shifting techniques in I²C-bus design (20-Jun-07)

Support Documents

75015669; Continuous innovation. Timeless lifespan. (01-Sep-06)

75011212; I2C 2002-1A Evaluation Board Kit (01-Mar-03)

UM10206_1; I2C Demonstration Board 2005-1 Quick Start Guide (13-Jun-06)

UM10204_3; I2C-bus specification and user manual (26-Jun-07)

75015961; NXP SO-DIMM and RDIMM temperature sensors SE97 and SE98 (2007-05-01)

Parametrics/similar products

Similar products

SE97 links to the similar products page containing an overview of products that are similar in function or related to the type number(s) as listed on this page. The similar products page includes products from the same catalog tree(s), relevant selection guides and products from the same functional category.

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