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High performance in extremely small packages

Our low voltage-drop MEGA (Maximum Efficiency General Application) Schottky diodes offer high performance in small packages. Expanding our discrete portfolio from extremely small packages to larger ones for medium power applications, the MEGA Schottky family exemplifies our commitment to developing these essential multimarket solutions.

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New and updated products

PMEG6030EVP

High-temperature 60 V, 3 A Schottky barrier rectifier

PMEG6002ELD

60 V, 0.2 A low VF MEGA Schottky barrier rectifier



Featured product

PMEG4050ETP - 5 A low V MEGA Schottky barrier rectifier

Datasheet (pdf)

Planar MEGA (Maximum Efficiency General Application) Schottky barrier rectifier with integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead SMD (Surface-Mounted Device) plastic package. Low forward voltage with high power capability due to clip-bond technology.



Key features and benefits

  • Very low forward voltage-drop, VF
  • High efficiency due to extremely low forward voltage
  • High continuous current capability, IF
  • Small and ultra small, low profile surface mount package for economic use of space
  • High peak current capability, IFSM
  • Excellent size / performance ratio together with extended battery life
  • AEC-Q101 qualified
  • Low power dissipation and low heat generation
  • High-speed switching combined wtih low reverse current
  • Robust designs and long product lifetime

Key applications

  • Low and medium power rectification
  • Power management circuits, especially DC-to-DC conversion
  • Reverse polarity protection
  • Low power application
  • Free wheeling diode for inductive loads in motors and relays

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A central place for your design support and tooling. For today´s short product development cycles, NXP helps you with this portal to simplify your design.
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Descriptive summary

These high performance diodes are available in various SMD packages, from ultra-small leadless such as SOD882 and new medium power leadless SOT1061 to FlatPower packages with clip-bond technology that meet the demand for thinner products with high power capabilities.

Low VF Schottky rectifiers and small packages

Based on an innovative wafer production process that enables high current handling and low power dissipation in a small footprint, these highly efficient devices allow designers to replace conventional Schottky diodes with smaller, more cost-effective products. Designed for a wide range of applications, MEGA Schottky diodes reduce overall system costs and enhance flexibility in circuit design. These small, high performance diodes allow designers to access increasingly smaller package options and enable real reductions in power usage, opening the way to extended battery lifetimes for portable devices - a critical market advantage.

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