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Integrated protection devices

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Integrated protection devices
IP4064CX8/LF - Integrated SIM card passive filter array with ESD protection to IEC61000-4-2, level 4
IP4064CX8/LF/S - Integrated SIM card passive filter array with ESD protection to IEC61000-4-2, level 4
IP4220CZ6 - Dual USB 2.0 integrated ESD protection to IEC 61000-4-2 level 4
IP4221CZ6-S - Dual USB 2.0 integrated quad with ESD protection to IEC 61000-4-2, level 4 (Pb-free)
IP4280CZ10 - ESD protection for HDMI interface
IP4364CX8/LF - Integrated SIM card passive filter array with ESD protection to IEC61000-4-2, level 4
IP4770CZ16 - VGA/video interface with integrated buffers, ESD protection and integrated termination resistors
IP4771CZ16 - VGA/video interface with integrated buffers, ESD protection and integrated termination resistors
IP4772CZ16 - VGA/video interface with integrated buffers, ESD protection and integrated termination resistors
IP4776CZ38 - Fully integrated HDMI interface with level shifter, ESD and backdrive protection
IP4777CZ38 - DVI and HDMI interface ESD protection, DDC buffering, hot plug control, multiplexing option and backdrive protection
IP4778CZ38 - HDMI ESD protection, DDC buffering and hot plug control

Latest products

IP4221CZ6-S

Dual USB 2.0 integrated quad with ESD protection to IEC 61000-4-2, level 4 (Pb-free)

Datasheet (80Kb)

Latest user manuals

UM10072 2 (384Kb)
UM10066 3 (577Kb)

Our integrated discrete ESD protection devices are the ideal solution for protecting your portable and other space-constrained systems. Housed in compact package options including wafer-level chip scale packaging, they often integrate additional functionality such as EMI filtering or level-shifting. Some devices go even further, offering complete, integrated ESD protection for interfaces such as HDMI, DVI, USB 2.0 or VGA.

Key features

  • Highly integrated ESD protection devices often including additional functionality
    - EMI filtering
    - Level-shifting
  • Available types can also offer integrated ESD protection for specific interfaces
    - HDMI
    - DVI
    - USB 2.0
    - VGA
  • Range of compact package options
    - Including wafer-level chip scale packaging

Key benefits

  • High ESD protection performance
    - ESD IEC 61000-4-2 level 4, +-8 kV contact discharge
  • High level of integration and small packages reduce board space requirements by 90 %
  • Component count reduction up to factor 50
  • Improved performance
  • Reduced reliability and assembly cost
  • BoM cost reduction

Key applications

  • Portable and other space-constrained systems requiring high levels of integration
  • Computers and PC peripherals
  • Consumer applications such as TVs, STBs, DVDs, media stations, game consoles

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