Specifically designed for high volume logistics involving millions of items per year, ICODE offers a low-cost, re-programmable and disposable solution for source tagging, automatic data capture, theft protection and data storage on a product or its packaging.
ICODE is the industry standard for high-frequency (HF) smart label solutions. With more than 700 million ICs sold, representing the world's largest installed base, ICODE is a proven and reliable technology. The entire ICODE family is supported by ISO 15693, ISO 18000-3 and EPCglobal compliant infrastructure. Developed in close cooperation with end users and system integrators, it delivers the best price / performance ratio on the market.
ICODE is an open platform, available to any company willing to develop, market and sell ICODE-compatible products and services. Thanks to our Open Value Chain Strategy, NXP is your ideal partner to deliver benchmark RFID solutions globally - whether you're a smart label manufacturer, component supplier or system integrator.
The ICODE Interface Platform currently consists:
Request-Form for Passwords for Confidential ICODE Documents (18kB)
SL1 ICS30 01, ICODE1 Label IC, Chip Specification (368kB)
SL1 ICS30 01, Bumped ICODE1 Label IC (IC with Bumps),Chip Specification (375kB)
SL1 ICS31 01; ICODE1 Label IC(97pF) Chip Specification (366kB)
SL1 ICS31 01; ICODE1 Label IC(97pF); (IC with Bumps) Chip Specification (377kB)
ICODE1 Label ICs, Protocol Air Interface, Datasheet (370kB)
Addendum, SL1 MOA2 S30, Contactless Chip Card Module Specification (32kB)
SL2 ICS10; ICODE EPC Smart Label IC; Functional Specifictaion (550kB)
SL2 ICS10; ICODE EPC Smart Label IC; Bumped Wafer Specification (203kB)
SL2 ICS11; ICODE UID Smart Label IC; Functional Specification (582kB)
Addendum, SL2 ICS 11; ICODE UID Smart Label IC; Bumped Wafer Specification (197kB)
NXP ICODE UID-OTP smart label IC SL2 ICS12 (521kB)
Short Form Specification; ICODE SLI; SL2 ICS20 Smart Label ISO IC (71kB)
ICODE SLI; Smart Label IC; SL2 ICS20 Functional Specification (79kB)
Addendum, SL2 FCS20 I-CONNECT SLI Flip Chip Package Specification (29kB)
Addendum, SL2 ICS20, ICODE SLI Label IC, Bumped Wafer Specification (41kB)
SL2 ICS50/SL2 ICS51 ICODE SLI-L/ I CODE SLI-L/HC (785kB)
SL2 ICS50 Wafer addendum (2,747kB)
SL2 ICS51 Wafer addendum (2,935kB)
SL2 ICS53/SL2 ICS54 ICODE SLI-S/HC Functional Specification (941kB)
SL2 ICS53 Wafer Addendum (2,746kB)
SL2 ICS54 Wafer Addendum (2,935kB)
ICODE1 System Design Guide (488kB)
ICODE1; Guidelines on the use of ICODE1 label ICs concerning the different input capacitances, Application Note (41kB)
ICODE 1 Label IC, Coil Design Guide, Application Note (164kB)
ICODE Design of Read/Write Antennas, Application Note (555kB)
Temperature Management; Inlet design, Application Note (108kB)
Delivery Type Specification; General Specification for 8 inch Wafer (279kB)
Delivery Type Specification; FCP2 Flip Chip Package Specification (1,280kB)
Processing of Flip Chip Package (147kB)
General Specification for Packages in super 35mm reel Format; Data Sheet (369kB)