MIFARE classic is the brand name for ICs with a MIFARE Interface and MIFARE classic communication protocol and security mechanisms. NXP Semiconductors currently supplies two versions: The MIFARE Standard with 1 Kbytes EEPROM and the MIFARE Standard 4k with 4 Kbytes of EEPROM.
The MIFARE classic family is the pioneer and front runner in contactless smart card ICs operating in the 13.56 MHz frequency range with read/write capability. The MIFARE standard IC, launched in 1995, was the first product which could be fitted into a ISO contactless smart card, and with its slim coil allowed very high volume production.
Today, over 1 billion MIFARE ICs are in use around the globe, covering more than 70% of the contactless smart card market. As such, MIFARE has become the industry's choice.
For multi-application cards, the MIFARE Standard IC can support up to 40 different applications on the chip, each with its own dedicated keys and memory area.
MIFARE ultralight ICs are based on the same command set to support low cost ticketing applications on the existing and future MIFARE infrastructure.
Contactless MIFARE ICs are available as 150 µm sawn wafers, 150µm Au-bumped sawn wafers (both 8") or in ultra thin metal lead frame chip modules. A wide variety of transponder shapes, in addition to the classical ISO smart card transponder, are also available including watches, key fobs, disks, etc.
MIFARE Standard was the first IC to be used in high volume public transport ticketing in a major transport project in Seoul, Korea. Continuing that success, cities such as London, Beijing, Taipei, Pusan and many more are adopting MIFARE as the contactless interface platform for the present and future.
With the emergence of the MIFARE dual interface controller, which provides additional support for open e-purse schemes, MIFARE Classic ICs are primarily used in closed ticketing systems.
Classic 1k
MF1 IC S50 Functional Specification (350kB)
MF1 IC S50 05 Standard Card IC Sawn Wafer on UV-Tape (244kB)
MF1 IC S50 05 Bumped sawn wafer on UV-tape addendum (233kB)
MF1 IC S50 06 Wafer specification addendum (236kB)
MF1 MOA2 S50 Contactless Chip Card Module Addendum (44kB)
MF1 MOA4 S50 Contactless Chip Card Module (42kB)
Addendum; MIFARE MF1 FCP2 S50, Flip Chip Package Specification (35kB)
Classic 4k
MF1ICS70 Functional specification (413kB)
Addendum Mifare Standard 4 kByte Card IC MF1 IC S70 01 Specification; Sawn Wafer on UV-tape (369kB)
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MF1 IC S70 01 Sawn bumped 380µm wafer addendum (286kB)
MF1 ICS 70 01; Standard 4kbyte card IC bumped sawn wafer on UV tape addendum (285kB)
Addendum Mifare MF1 MOA4 S70 Contactless Chip Card Module Specification (180kB)
MF1 IC S50 07 Standard Card IC Sawn Bumped Wafer (2970kB)
MF1 IC S50 07 Sawn wafer addendum (3048kB)
Mini
MF1ICS20 Functional Specification (372kB)
MF1 IC S20 07 Sawn wafer on UV tape addendum (3047kB)
MF1 IC S20 05; Sawn bumped 120µm wafer addendum (85kB)